Silicon Carbide Power Devices R&D engineer, MEng in Material Science
I am a R&D engineer working on the development of wide-bandgap SiC power devices.
👨🎓 Biography
Hey! My name is Qi Guo (郭齐) and I am working on the R&D of silicon carbide power semiconductors, and also have rich experience in GaN HEMTs and LEDs including fabrication, characterization, and TCAD simulation.
I have obtained a Master of Engineering (MEng) degree from the Guangxi University and Chinese Academy of Sciences, focusing on the research of theoretical modeling and the wafer-to-device fabrication of GaN HEMT and LEDs. I have published many peer-reviewed high-impact factor papers on this topic, including Nano Letters, Advanced Electronic Materials, and AIP Advances. Furthermore, I also received a bachelor's degree from the Anhui University of Technology, where I studied basic knowledge of semiconductors and LEDs.
I am interested in the research of wide-bandgap power devices and am committed to the R&D of next-generation renewable energy conversion technologies.
👩💼 Professional Experience
Silicon Carbide Power Devices R&D Engineer
Aug 2021 - Oct 2022 Shanghai
WeEn Semiconductors Co. Ltd
- Participated in the formulation of the product's Qual plan and the product development and project management of SiC power chip products, and was responsible for the writing of technical reports and datasheets.
- Participated in R&D of New X-tal SiC 1200V SBD (VF=1.42V), and SiC 650V SBD made (VF=1.29V), and 40mOhm SiC 650V MOSFET for 6-inch wafers. Formulation of relevant design documents, process documents, packaging, and testing documents for SiC power device products.
- Responsible for device simulation, layout design, process formulation, and optimization of SiC power devices. The formulation of wafer benchmark test and CP data analysis for SIC devices, DOE design of SiC process docking in FAB factory, and optimization of 650V 20A SBD MPS process.
👩💻 Research Experience
Enhanced Heat Dissipation in Gallium Nitride-Based Light-Emitting Diodes by Piezo-phototronic Effect
Sep 2019 - Jun 2021 Beijing
MEng Research, University of Chinese Academy of Sciences
- Fabricated the GaN-based MQW HP-LEDs with micro-nano processes from epitaxial wafers and performed high-resolution infrared thermography to measure the self-heating temperature under external strains.
- The temperature rise caused by the self-heating effect is reduced by 47.62% under 0.1% external strain, which is attributed to the enhanced competitiveness of radiative recombination against nonradiative recombination due to the piezo-phototronic effect.
- This work has been published in peer-reviewed journals Nano Letters funded through National Natural Science Foundation.
Magnetosensory Power Devices based on AlGaN/GaN Heterojunctions for Interactive Electronics
Sep 2019 - Jul 2021 Beijing
MSc Research, University of Chinese Academy of Sciences
- Designed a novel magnetosensory power device based on AlGaN/AlN/GaN heterojunction. Its output power can be significantly modulated by the external magnetic field.
- Fabricated the device with micro-nano processes from epitaxial wafers. The 2DEG concentration is 1.2E13/cm2, and the maximum output power density reaches 8.6 KW/cm2. Under the external magnetic field of 0 - 400 mT, the output power density of MPD increases from 1.804 KW/cm2 to 1.894 KW/cm2 at Vgs = -5 V.
- This work has been published in the peer-reviewed journal Advanced Electronic Materials funded through National Natural Science Foundation
Temperature-Dependent Study on AlGaN-based Deep Ultraviolet Light-Emitting Diodes for the Origin of High Ideality Factor
Sep 2019 - Jun 2021 Beijing
MEng Research University of Chinese Academy of Sciences
- Developed a simple and convenient method to study the behavior of a 280 nm AlGaN-based DUV LED, obtaining the electrical, optical, and thermal properties within one measurement.
- The light output power and wall-plug efficiency of the AlGaN-based DUV LED are strongly affected by device temperature, ideality factor (β), and series resistance (Rs). β decreases from 9.3 to 8.1 at 40 mA when the temperature increases from 302 K to 317 K.
- Performed the TCAD simulation with Crosslight APSYS and revealed that the high potential barriers inside the device and the hole concentration in p-type layers are the two key factors for the high value of the ideality factor.
- This work has been published in peer-reviewed journals AIP Advances funded through National Natural Science Foundation.
📚 Publications
- Xingyu Zhou, Qilin Hua, Wei Sha, Jiyuan Zhu, Ting Liu, Chunyan Jiang, Qi Guo, Liang Jing, Chunhua Du, Junyi Zhai, Weiguo Hu, Zhong Lin Wang. Magnetosensory power devices based on AlGaN/GaN heterojunctions for interactive electronics. Advanced Electronic Materials. 9.5 (2023): 2200941. https://doi.org/10.1002/aelm.202200941 (PDF)
- Guo Qi, Ding Li, Qilin Hua, Keyu Ji, Wenhong Sun, Weiguo Hu, and Zhong Lin Wang. "Enhanced heat dissipation in gallium nitride-based light-emitting diodes by piezo-phototronic effect." Nano Letters 21, no. 9 (2021): 4062-4070. https://doi.org/10.1021/acs.nanolett.1c00999 (PDF)
- Liao, Yanjun, Ding Li, Qi Guo, Yufeng Liu, Haiming Wang, Weiguo Hu, and Zhong Lin Wang. "Temperature-dependent study on AlGaN-based deep ultraviolet light-emitting diode for the origin of high ideality factor." AIP Advances 11, no. 10 (2021): 105214. https://doi.org/10.1063/5.0059256 (PDF)
- Su, Mengwei, Xinglin Zhu, Qi Guo, Zhiqiang Chen, Shaodong Deng, Ziqian Chen, Yukun Wang, Jianyu Deng, and Wenhong Sun. "Characterization and simulation of 280 nm UV-LED degradation." AIP Advances 11, no. 3 (2021): 035315. https://doi.org/10.1063/5.0040008 (PDF)
- Ji, Keyu, Xiao Cui, Jiwei Chen, Qi Guo, Bing Jiang, Bingjun Wang, Wenhong Sun, Weiguo Hu, and Qilin Hua. "Effect of backside dry etching on the device performance of AlGaN/GaN HEMTs." Nanotechnology 32, no. 35 (2021): 355203. https://doi.org/10.1088/1361-6528/ac02e7 (PDF)
- Peng, Yi, Muhammad Farooq Saleem, Wenwang Wei, Keyu Ji, Qi Guo, Yang Yue, Jie Chen, Xuan Zhang, Yukun Wang, and Wenhong Sun. "Formation of β-Be3N2 nanocrystallites in Be-implanted GaN." Materials Research Express 8, no. 3 (2021): 035003. https://doi.org/10.1088/2053-1591/abea59 (PDF)
🎓 Education
University of Chinese Academy of Sciences
Beijing (June 2019 - Sep 2021)
Joint master student in Materials Science and Engineering
Guangxi University
Nanning (June 2018 - Sep 2021)
MEng in Materials Science and Engineering
Anhui University of Technology
Maanshan (June 2014 - Sep 2018)
BEng in Lamps and Lighting